Micro-foaming Breakthrough Enhances Heat Dissipation of Cold Plates

Heat dissipation efficiency is the core performance metric of Vapor Chamber (VC) cold plates. Amid the stringent demands of high-power AI servers, conventional cold plates are plagued by insufficient heat transfer capacity and low thermal radiation efficiency. To break through this bottleneck, the "Suanli Xinhu" (Core Protection for Computing Power) Team focused on optimizing micro-foaming technology, enhancing the thermal radiation and heat transfer performance of cold plates through technological innovation.

The micro-foaming process improves heat dissipation efficiency by forming a specialized foam structure that enlarges the heat exchange area, enhances fluid turbulence, and boosts thermal radiation. However, traditional processes suffer from inherent drawbacks, including uneven structure, weak bonding strength, and poor long-term stability, making them unable to meet the continuous high-load operation requirements of high-end servers.

Starting from fundamental theories, the team investigated the impacts of foaming mechanism, material formulation, and process parameters. Through extensive trials, the team optimized key parameters including foam pore size, pore distribution, and structural thickness, resulting in a micro-foam structure with superior uniformity, stability, and application fit.

(The team conducts technical exchanges)

During R&D, the team encountered multiple technical challenges, including uneven foaming, insufficient bonding strength, and inaccurate process control. The team overcame these obstacles one by one by adjusting material formulations, optimizing process flows, and achieving precise parameter control. After hundreds of iterative experiments, a mature, stable process solution was finally developed.

The new process delivers remarkable performance improvements: the optimized structure enlarges the heat exchange area, intensifies fluid turbulence, and elevates the efficiency of thermal radiation and heat conduction, driving a significant increase in the heat dissipation power of the VC cold plate. This enables the product to perfectly adapt to the requirements of 300W to 800W high-power chips. Meanwhile, the process optimization does not introduce excessive additional costs, maintaining an excellent cost-performance ratio and realizing the goal of "enhanced performance with no price increase".

This breakthrough in micro-foaming technology marks a critical milestone in core heat dissipation technology. It addresses the core pain point of insufficient heat transfer efficiency in conventional cold plates, and lays a solid foundation for subsequent product iterations. The team has integrated this technology with other proprietary innovations, including bionic flow channels and interfacial micro-texture, to form a multi-dimensional heat transfer enhancement system and sustain its leading position in the industry.

Behind this process innovation lies the team's relentless pursuit of technological excellence. Rather than settling for "functional" products, the team strives for solutions that are "user-friendly, durable, and highly efficient", with unwavering courage to break boundaries and innovate. This craftsmanship spirit has enabled a leapfrog improvement in the heat dissipation performance of VC cold plates, delivering higher-quality, more reliable solutions for the industry.

Breaking new ground through process innovation, empowering development through technological upgrading. Through the revolutionary innovation of micro-foaming technology, the "Suanli Xinhu" Team has demonstrated the power of independent innovation, built a solid thermal protection barrier for computing chips with hard-core technology, and boosted China's domestic liquid cooling heat dissipation industry to a new height.